Hybrid PCB | Mixed Material 4-layer PCB Made On 20 mil RO4350B + FR4 With Blind Via

Hybrid PCB | Mixed Material 4-layer PCB Made On 20 mil RO4350B + FR4 With Blind Via

(Printed circuit boards are custom-made products, the picture and parameters shown are just for reference)

Hello everyone,

Continued with last article, today we’re going to talk about the 20mil RO4350B and FR-4 mixed.

Most of the situations are that the high frequency material plays the role of signal transmission. Let’s see the stack-up.

Layer 1 to layer 2 is the core of 20mil (0.508mm) RO4350B high frequency material, the signal transmission lines are on first layer copper, then layer 3 to layer 4 is another core of epoxy glass material. The 2 cores are bonded by a sheet of adhesive (prepreg).

Basic specifications

Base material: RO4350B 0.508 mm + FR4 0.6mm + PP 0.306mm

Layer count: 4 layers

Panel: 75mm x 82mm = 1 type = 1 piece

Surface finish: Immersion gold

Copper weight: Outer layer 70 um/ Inner layer 35 um

Solder mask / Legend: green / white

Final PCB height: 1.6 mm

Standard: IPC 6012 Class 2

Packing: 20 panels are packed for shipment.

Lead time: 10 working days

Shelf life: 6 months

Features and benefits

1) The temperature coefficient of dielectric constant is among the lowest of any circuit board material, making it ideal for temperature sensitive applications;

2) RO4350B exhibits a stable dielectric constant over a broad frequency range. This makes it an ideal substrate for broadband applications;

3) Signal integrity performance improvement over the stack-ups with all FR4 board;

4) ISO9001, ISO14001, IATF16949, UL Certified factory

5) Prototype to mass production capability;

Applications

Mixer, Radar data acquisition converter, Spread spectrum, Duplexer

Parameter and Data Sheet