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High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

Shenzhen Bicheng Electronics Technology Co., Ltd
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High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

Brand Name : Bicheng Technologies Limited

Model Number : BIC-507-V0.62

Certification : UL

Place of Origin : China

MOQ : 1

Price : USD 2.99-9.99 PER PIECE

Payment Terms : T/T, Western Union

Supply Ability : 45000 pieces per month

Delivery Time : 10 working days

Packaging Details : Vacuum

Number of Layers : 2

Glass Epoxy : IT-180ATC

Final foil : 1.0 Oz

Final height of PCB : 1.6 mm ±10%

Surface Finish : Immersion gold

Solder Mask Color : Green

Colour of Component Legend : White

Test : 100% Electrical Test prior shipment

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High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Brief Introduction

This is a type of standard double sided high temperature PCB which is built on ITEQ’s IT-180ATC laminate. There are 10 boards paneled up in the array. They are 1.6mm thick with 2oz copper, coating with immersion gold on pads and green solder mask protection for substrate. 25 pieces are vacuum packed for shipment.

Applications

Automotive (Engine room ECU)

Backplanes

Data Storage

Server and Networking

Telecommunications

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB

PCB Parameters

Item Description Requirement Actual Result
1. Laminate Material Type FR-4 IT-180ATC FR-4 IT-180ATC ACC
Tg 170℃ 170℃ ACC
Supplier ITEQ ITEQ ACC
Thickness 1.6±10% mm 1.63-1.68mm ACC
2.Plating thickness Hole Wall ≥25µm 26.51µm ACC
Outer copper 35µm 41.09µm ACC
Inner Copper
3.Solder mask Material Type TAIYO/ PSR-2000GT600D TAIYO/ PSR-2000GT600D ACC
Color Green Green ACC
Rigidity (Pencil Test) ≥4H or above 5H ACC
S/M Thickness ≥10 µm 20.11µm ACC
Location Both Sides Both Sides ACC
4. Component Mark Material Type TAIYO/ IJR-4000 MW300 IJR-4000 MW300 ACC
Color White White ACC
Location C/S C/S ACC
5. Peelable Solder Mask Material Type
Thickness
Location
6. Identification UL Mark YES YES ACC
Date Code WWYY 2121 ACC
Mark Location Solder Side Solder Side ACC
7. Surface Finish Method Immersion Gold Immersion Gold ACC
Tin Thickness
Nickel Thickness 3-6µm 4.06µm ACC
Gold Thickness 0.05µm 0.056µm ACC
8. Normativeness RoHS Directive 2015/863/EU OK ACC
REACH Directive 1907 /2006 OK ACC
9.Annular Ring Min. Line Width (mil) 5mil 4.8mil ACC
Min. Spacing (mil) 5mil 5.2mil ACC
10.V-groove Angle 30º 30º ACC
Residual thickness 0.4±0.1mm 0.43mm ACC
11. Beveling Angle
Height
12. Function Electrical Test 100% PASS 100% PASS ACC
13. Appearance IPC Class Level IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Visual Inspection IPC-A-600J &6012D Class 2 IPC-A-600J &6012D Class 2 ACC
Warp and Twist ≦0.7% 0.21% ACC
14. Reliability Test Tape Test No Peeling OK ACC
Solvent Test No Peeling OK ACC
Solderability Test 265 ±5℃ OK ACC
Thermal Stress Test 288 ±5℃ OK ACC
Ionic Contamination Test ≦ 1.56 µg/c㎡ 0.56µg/c㎡ ACC


Hole Diameter Measurement (Unit: mm),Tolerance: PTH±0.075; NPTH±0.05

Hole Code PTH Required Actual value Result
1 Y 0.400 0.400 0.425 0.425 0.400 ACC
2 Y 0.450 0.450 0.500 0.475 0.450 ACC
3 Y 0.600 0.600 0.650 0.625 0.600 ACC
4 Y 0.725 0.750 0.775 0.775 0.750 ACC
5 Y 0.850 0.850 0.825 0.850 0.825 ACC

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB


China High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB wholesale

High Tg Printed Circuit Board Made on IT-180ATC with Immersion Gold Double Sided High Temperature PCB Images

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